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Solder Paste in Electronics Packaging - Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly eBook by Jennie S. Hwang

Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

ebook
Jennie S. Hwang
History (R0)

Synopsis

About this book

  • Language:English
  • ISBN:9789401160506
  • Release date:Jan 17, 2015
  • Publisher:Springer Netherlands
  • Imprint:Springer
  • File format:EPUB2
  • File size:21.64 MB
  • Download options:EPUB2 (Adobe DRM)