This book shows readers how to design semiconductor devices using the most common and lowest cost logic CMOS processes. Readers will benefit from the author’s extensive, industrial experience and the practical approach he describes for designing efficiently semiconductor devices that typically have to be implemented using specialized processes that are expensive, time-consuming, and low-yield. The author presents an integrated picture of semiconductor device physics and manufacturing techn...

A comprehensive guide to 3D MEMS packaging methods and solutionsWritten by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.This definitive resource helps you selec...

Complete, State-of-the-Art Coverage of Sensor Technologies and ApplicationsFully revised with the latest breakthroughs in integrated sensors and control systems, Sensors Handbook, Second Edition provides all of the information needed to select the optimum sensor for any type of application, including engineering, semiconductor manufacturing, medical, military, agricultural, geographical, and environmental implementations.This definitive volume discusses a wide ar...

This book offers an essential compendium on the analysis and design of synchronous motors for variable-speed applications. Focusing on synchronous reluctance and ferrite permanent-magnet (PM) synchronous reluctance machines, it provides a broad perspective on three-phase machines for variable speed applications, a field currently dominated by asynchronous machines and rare-earth PM synchronous machines. It also describes synchronous reluctance machines and PM machines without rare-earth ma...

Whether you are an RF transistor designer, an amplifier designer or a system designer, this is your one-stop guide to RF and microwave transistor power amplifiers. A team of expert authors brings you up to speed on every topic, including: devices (Si LDMOS and VDMOS, GaAs FETs, GaN HEMTs), circuit and amplifier design (discrete, hybrid and monolithic), CAD, thermal design, reliability, and system applications/requirements for RF and microwave transistor amplifiers. Covering state-of-the-ar...

Proven methods for noise-tolerant nanoscale integrated circuit designThis leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, suc...

Next-generation small antenna design techniquesThis authoritative text provides the most up-to-date methods on the theory and design of small antennas, including an extensive survey of small antenna literature published over the past several years. Written by experts at the forefront of antenna research, Small Antennas: Miniaturization Techniques & Applications begins with a detailed presentation of small antenna theory--narrowband and wideband--and progresses to small a...

This book is an authoritative review of current and future trends in the field of telecommunications. Written by industry experts who are developing leading-edge data communication networks, Fiber Optic Data Communication provides professionals and students alike with a look at emerging technologies and their applications. Four of the chapters have been revised from DeCusatis's best-selling book, Handbook of Fiber Optic Data Communications; the remaining eight chapters are all new. Seven h...

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid vari...

As power systems develop to incorporate renewable energy sources, the delivery systems may be disrupted by the changes involved. The grid’s technology and management must be developed to form Smart Grids between consumers, suppliers and producers. Conducted Electromagnetic Interference (EMI) in Smart Grids considers the specific side effects related to electromagnetic interference (EMI) generated by the application of these Smart Grids.Conducted Electromagnetic Interference (EMI) in...

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored t...

This book focuses on the latest research and developments in photovoltaic (PV) power plants, and provides extensive coverage of fundamental theories, current research and developmental activities, and new approaches intended to overcome a number of critical limitations in today’s grid integration technologies. The design and implementation process for large-scale solar PV power plants is introduced. The content provided will actively support the development of future renewable power plants...