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de Muhammad Azhar Iqbal, Sajjad Hussain, Huanlai Xing, Muhammad Ali Imran ...

Series series IEEE Press
LEARN MORE ABOUT FOUNDATIONAL AND ADVANCED TOPICS IN INTERNET OF THINGS TECHNOLOGY WITH THIS ALL-IN-ONE GUIDEEnabling the Internet of Things: Fundamentals, Design, and Applications delivers a comprehensive starting point for anyone hoping to understand the fundamentals and design of Internet of Things (IoT) systems. The book's distinguished academics and authors offer readers an opportunity to ... Leer más

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Series series Quality and Reliability Engineering Series
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Series Libro 6 - Handbook of Sensors and Actuators
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de Kung Linliu ...

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$1,179 MXN o gratis con Kobo Plus

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de Arshad Iqbal ...

Series series Electronics Quick Study Guides & Terminology Notes about Everything
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de Franco Zappa, Rita Asquini ...

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The book is aimed at readers interested in the hardware design of digital electronic circuits and systems. It introduces the basics of digital electronics and then describes in detail both combinational and sequential components. The book aims at providing an indepth overview of commercially available off-the-shelf devices necessary to design low-and medium-complexity digital electronic systems
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Electronic Skin

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Wide Bandgap Semiconductor Spintronics

de Vladimir Litvinov ...

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Hybrid Microcircuit Technology Handbook

Materials, Processes, Design, Testing and Production

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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly ... Leer más

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Series series Instant Access
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eBooks de Microelectrónica

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Wide Bandgap Nanowires

Nanocomputers and Swarm Intelligence

Hardware Implementation of Finite-Field Arithmetic

Reliability Prediction for Microelectronics

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

Micro Mechanical Systems

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半導體製程: 微影與蝕刻

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