
Solder Paste in Electronics Packaging
Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Synopsis
Om denne bog
- Sprog:English
- ISBN:9789401160506
- Udgivelsesdato:17. jan. 2015
- Udgiver:Springer Netherlands
- Tryk:Springer
- Filformat:EPUB2
- Filstørrelse:21.64 MB
- Downloadmuligheder:EPUB2 (Adobe DRM)