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Engineering (R0) eBook Series

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  • 3D Microelectronic Packaging

    From Architectures to Applications

    Edited by Yan Li, Deepak Goyal ...
    Series series Engineering (R0)
    This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro ... Read more

    $207.53 CAD